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DST3

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The DST3, Triple Target Sputter Coater, is equipped with a large chamber (300 mm diameter) and three 2” diameter water-cooled cathodes which make it suitable for long time deposition. The desk magnetron coater is equipped with RF and DC power supplies. It can sputter semiconductors, dielectrics and metal (oxidizing & noble) targets (Deposition Table). The Confocal Sputter Coater is equipped with an auto adjustable matching box, minimizing the reflected power in the RF Sputtering.

For increasing film adhesion to the substrate and to improve the film structures, a 300 V, DC bias voltage can be applied to the substrate (optional).

According to state of the cathodes, DST3 is available in two models:

DST3-A (Angled Cathodes):
The DST3-A is equipped with three angled cathodes with a common focal point. It can sputter from two or three (optional) targets simultaneously or independently to form alloys or multilayer deposition respectively. The maximum size of substrates in this model could be 3”.

DST3-S (Straight Cathodes):
The DST3-S with three straight cathodes is suitable for sputtering a single large specimen with diameter up to 20 Cm or several small specimens.

Model: DST3
Product Type: PVD

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Description

Benefits

Benefits

  • Applications
    o Metal, Semiconductor and Dielectric Films
    o Nano & Microelectronic
    o Solar Cell applications
    o Co-Sputtering processes
    o Glad Sputtering
    o Optical components coating
    o Thin film sensors
    o Magnetic thin film devices
    o Fine grain structural deposition for SEM & FE-SEM sample preparation
  • Independent sputtering control rate for each cathode to produce fine grain structures
  • Automatic safe control of the cathode’s temperatures
  • Two precision Mass Flow meter (MFC) for fine control of vacuum and pressure

Downloads

Downloads

DTT VacCoat Ltd brochure RV

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